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  1. general description the uba2017/uba2017a are high-voltage integrated circuits (ic) intended to drive fluorescent lamps with filaments such as tube lamps (tl) and compact fluorescent lamps (cfl) in general lighting applications. the ic comprises a fluor escent lamp control module, half-bridge driver and several protec tion mechanisms. the ic drives fluorescent lamps using a half-bridge circuit made of two mosfets with a supply voltage of up to 600 v. the uba2017/uba2017a are supplied by a start-up bleeder resistor and a dv/dt supply from the half-bridge circuit, or any other auxiliary supply deri ved from the half-bridge. the supply current of the ic is low. an internal clamp limits the supply voltage. 2. features and benefits ? half-bridge driver features: ? integrated level-shifter for the high-side driver of the half-bridge ? integrated bootstrap diode for the high-side driver supply of the half-bridge ? independent non-overlap time ? fluorescent lamp controller features: ? linear dimming (uba2017a only) ? eol (end-of-life) detection (both symmetrical and asymmetrical) ? adjustable preheat time ? adjustable preheat current ? adjustable fixed frequency preheat ? lamp ignition failure detection ? ignition detection of all lamps at mult iple lamps with separate resonant tanks ? second ignition atte mpt if first failed ? constant output power independent of mains voltage variations ? automatic restart after changing lamps ? lamp current control ? enable input ? protection ? hard switching/capacitive mode protection ? half-bridge overcurrent (coil saturation) protection ? lamp overvoltage (lamp removal) protection ? temperature protection uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function rev. 2 ? 15 may 2012 product data sheet
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 2 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function 3. applications ? intended for fluorescent lamp ballasts with either a uba2017a dimmable or a uba2017 fixed output for ac mains voltages up to 390 v. 4. ordering information [1] if you require pfc functionality, see the uba2016a, uba2015a and uba2015. table 1. ordering information type number package name description version uba2017t/n1 so16 plastic small package outline package; 16 leads; body width 3.9 mm sot109-1 uba2017at/n1 uba2017p/n1 dip16 plastic dual in-line package; 16 leads; (300 mil) sot38-4 UBA2017AP/n1 table 2. functional selection type pfc dimmable fixed frequency preheat uba2017p/t no [1] no yes UBA2017AP/at no [1] yes yes
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 3 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function 5. block diagram (1) pin 10 is not connected in the uba2017p/t. fig 1. block diagram uba2017    
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uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 4 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function 6. pinning information 6.1 pinning 6.2 pin description uba2017t: pin 10 is n.c. (not connected). uba2017at: pin 10 is input pin dim. uba2017p: pin 10 is n.c. (not connected). UBA2017AP: pin 10 is input pin dim. fig 2. pin configuration uba2017t/uba2017at (so16) fig 3. pin configuration uba2017p/UBA2017AP (dip16) aaa-001477 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 uba2017 slhb ghhb ifb fshb eol shhb vfb glhb iref vdd cifb gnd cf dim or n.c. cpt ph/en aaa-001478 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 slhb ifb eol vfb iref cifb cf cpt ghhb fshb shhb glhb vdd gnd dim or n.c. ph/en uba2017 table 3. pin description symbol pin description uba2017at/ap uba2017p/t slhb 1 1 half-bridge (hb) low-side switch current sense input ifb 2 2 lamp current feedback input eol 3 3 end-of-life sensing input vfb 4 4 lamp voltage feedback input iref 5 5 reference current setting cifb 6 6 lamp current feedback compensation cf 7 7 high frequency (hf) oscillator timing capacitor cpt 8 8 preheat and fault timing capacitor ph/en 9 9 preheat frequency setting combined with enable dim 10 - dimming function input (uba2017at/ap) n.c. - 10 uba2017p/t gnd 11 11 ground vdd 12 12 supply glhb 13 13 hb low-side switch gate driver output shhb 14 14 hb high-side source connection fshb 15 15 hb floating supply connection ghhb 16 16 hb high-side switch gate driver output
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 5 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function 7. functional description 7.1 introduction the uba2017/uba2017a is an integrated circ uit for electronically ballasted fluorescent lamps. it provides a half-brid ge controller/driver with all the necessary functions for correct preheat, ignition and on-state operation of the lamp. several protection mechanisms are incorporated to ensure the safe operation of the fluorescent lamp or a shutdown of the complete ballast under any abnormal operating conditions or lamp failure. 7.2 half-bridge driver the ic incorporates drivers for the half-bridge switches and all related circuits such as non-overlap, high-voltage level shifter, bootstrap circuit for the floating supply and hard switching and capacitive mode detection. the uba2017/uba2017a is designed to drive a half-bridge inverter with an inductive load. the load consists typically of an inductor with a resonant capacitor and a tl or cfl. a basic half-bridge application circuit driving a tl is shown in figure 4 which also shows a typical ic supply configuration with a start-up bleeder resistor and a dv/dt supply. fig 4. basic half-bridge and ic supply connection diagram v bus vdd gnd ghhb shhb fshb glhb aaa-001479 uba2017 uba2017a
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 6 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function 7.2.1 vdd supply the uba2017/uba2017a is intended to be supplied by a start-up bleeder resistor connected between the bus voltage v bus and vdd and a dv/dt supply from the half-bridge point at pin shhb. the ic starts up when the voltage at pin vdd rises above start-up voltage v startup(vdd) and locks out (stops oscillating) when the volt age at pin vdd drops below stop voltage v stop(vdd) . the hysteresis between the start and stop levels allows the ic to be supplied by a buffer capacitor until the dv/dt supply is settled. the uba2017/uba2017a has an internal vdd clam p. this is an internal active zener (or shunt regulator) that limits the voltage on the vdd supply pin to clamp voltage v clamp(vdd) . no external zener diode is needed in the dv/dt supply circuit if the maximum current of the dv/dt supply minus the current consumption of the ic (mainly determined by the gate drivers? load) is below i clamp(vdd) . 7.2.2 low- and high-side drivers the low- and high-side drivers are identical. the output of each driver is connected to the equivalent gate of an external power mosfet. the high-side driver is supplied by the bootstrap capacitor, which is charged from the vdd supply voltage via an internal diode when the low-side power mosfet is on. the lo w-side driver is dire ctly supplied by the vdd supply voltage. 7.2.3 non-overlap during each transition between the two states glhb high/ghhb low and glhb low/ghhb high, glhb and ghhb are both low for a fixed non-overlap time t no to allow the half-bridge point to be charged or discharged by the load current (assuming the load always has an inductive behavior), and enabling zero voltage switching. see figure 5 .
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 7 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function 7.3 fluorescent lamp control the ic incorporates all the regulation and control needed for the fluorescent lamp(s), such as filament preheat, ignition frequency sweep, lamp voltage limitation, lamp current control, dimming, end-of-life detection, overcurrent protection and hard switching limiting. in the uba2017/uba2017a, seven different operating states can be distinguished. in each state the ic acts in a specific way, as described in the next paragraphs. figure 6 shows the possible transitions betwe en the states with their conditions. fig 5. oscillator, driver and half-bridge voltages t no time 0 v cf time v ghhb v shhb v shhb + v vdd v vdd v bus time 0 v glhb time 0 v shhb 001aam537
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 8 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function fig 6. state diagram reset or disable v dd high and enable and not(overtemp) glhb and (reset or disable) glhb and (v dd low or overtemp) reset restart not(reset) preheat time completed f low or ignition detected aaa-00148 0 non oscillating states (ic is off) low power consumption ghhb and gpfc low oscillating states (ic is on) reset state glhb low stop latch and ignition attempt counter are reset preheat state eol disabled frequency is decreased until hb preheat current or the set value for the preheat frequency is reached power on standby state glhb high stop state glhb low fast fault fault timeout other definitions: enable = (v ffprht > v th(en)(ffprht) ) disable = not(enable) ignition detected = (v ifb > v th(lod)(ifb) ) and (v vfb < v th(lod)(vfb) ) auto-restart state glhb low ignition state eol disabled frequency is decreased as long as no lamp overvoltage or hb overcurrent is detected burn state ignition attempt counter is reset eol protection enabled frequency determined by lamp current regulation loop fault timeout and (ignition attempts = 1) fault definitions: overtemp = fast fault = slow fault = the fault timer is started by slow fault and runs as long as slow fault continues. not(slow fault) resets the fault timer. (1) (burn state only) {set} t > t th(act)otp {reset} t < t th(rel)otp over voltage extra or capacitive mode or (over current lamp and f high) or coil saturation (1) cpt low or vfb low or over voltage or (over voltage end of life and not (deep dimming)) (1) or coil saturation or hardswitching or asymetrical end of life (1) fault timeout and (ignition attempts = 2) supply voltage definitions reset = (v dd < v rst(vdd) ) restart = (v dd < v restart (vdd)) v dd low = (v dd < v stop(vdd) ) v dd high = (v dd > v startup(vdd) )
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 9 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function 7.3.1 reset when voltage on pin vdd is below the reset voltage v rst(vdd) , both gates of the half-bridge driver are low. all internal latches are reset. when voltage on pin vdd rises above v rst(vdd) , the ic enters the standby state. 7.3.2 standby in the standby state, the low-side gate driver is on (glhb is high). the floating supply capacitor c fshb is then charged. when the vdd voltage rises above v startup(vdd) , the preheat state is entered. 7.3.3 oscillating states (preheat, ignition and burn) the highest and lowest oscillation fr equency can be set with capacitor c cf connected to the cf pin. the oscillator is implemented in such a way that the lowest frequency f sw(low) is the most accura te. in any oscillating state (preheat, ignition or burn), when vdd voltage drops below v stop(vdd) or overtemperature is detected, the half-bridge stops oscillation when glhb is high and enters the standby state. 7.3.4 preheat the oscillating frequency starts at f sw(high) (see figure 7 ? r esonance curve application ? point a) and remains at that frequency unt il the voltages at pins cpt and vfb settle above their pin short protection levels (v vfb > v th(osp)(vfb) and v cpt > v th(scp)(cpt) ). the half-bridge current or frequency is regulated when in the preheat state; see figure 7 ? r esonance curve application ? point b. pin cifb supplies a current i ch(cifb) to the externally connected compensation network on this pin and its voltage rises. this causes the switching frequency to decrease (pin cifb is the input for the volt age controlled oscillato r). this causes an in crease in half-bridge current (assuming the switching frequency is higher than the load resonance frequency). this current is measured via pin slhb using a resistor connected between the source of the low-side switch and ground. when the volt age on pin slhb rises above the preheat current control voltage v crtl(ph)slhb , discharge current i dch(cifb) replaces the charge current to pin cifb and the frequency is incr eased. when the voltage drops below v th(ocp)slhb , current i ch(cifb) from pin cifb causes the frequency to decrease.
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 10 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function the preheat frequency can also be regulated via pin ph/en. during preheat, the output voltage of pin ph/en is v ph(ph/en) . the output current that an external resistor r ext(ph/en) connected to this pin sinks is compared to 4 5 of the output current of the vco (the current at pin cf with no fault condition present and the capacitor at that pin being charged minus the same current at f sw(low) ). as long as the output curr ent of the vco is bigger the frequency is being decreased (by charging pin cifb with i ch(cifb) ). if the current through the external resistor is larger, the frequen cy is increased (by discharging pin cifb with i dch(cifb) ). current and fixed frequency control mechanisms are active at the same time. for fixed frequency preheat using pin ph/en, the half-br idge current sense resistor connected to pin slhb should be small enough not the ac tivate the current control mechanism. if current controlled preheat is used, pin ph/en should be left open (except for the open collector or open drain that drives the enable function). the preheat time t to(ph) can be set with capacitor c cpt on pin cpt. 7.3.5 ignition after the preheat state the ic enters the ignition state. during the ignition state, the switching frequency is decreased by charging pin cifb with i ch(cifb) . this will result in increasing lamp voltage until the lamp ignites (see point c in figure 7 ? r esonance curve application ? ) and lamp-on or f sw(low) (lowest frequency) is detected. lamp-on detection occurs when the average absolute voltag e on pin ifb is above lamp-on detection threshold v th(lod)(ifb) and the voltage on pin vfb is more than 50 % of each clock cycle below the lamp-on detection threshold v th(lod)(vfb) and after a delay t d(lod) . (1) lamp voltage when lamp is off (not ignited yet). (2) lamp current when lamp is on. fig 7. resonance curve application 001aan202 e d h b a c (1) (2) f sw(high) f sw(ph) f (1) v lamp (2) i lamp f sw(dim) f sw(ign) f sw(reg) f sw(low) v ign i lamp(nominal)
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 11 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function if either saturation or overvoltage is triggered, it overrules the frequency sweep-down and hold the frequency at the border where the fault appeared and start the fault timer. when the fault time-out t to(fault) is reached the ic enters the auto-restart state if it was the first ignition attempt, otherwise it enters the stop state; see figure 6 ? state diagram ? . 7.3.6 auto-restart the auto-restart state is entered after a fault time-out in the ignition state during the first ignition attempt. see figure 6 ? state diagram ? . when the ic is in the auto-restart state, it draws supply current i restart(vdd) . this slowly discharges the buffer capacitor on pin vdd until the voltage on this pin drops below v restart(vdd) . the ic then enters the standby state. here the vdd capacitor is charged again to start a second ignition attempt. the bleeder current must be between standby current i stb(vdd) and i restart(vdd) . a time delay can be set between the two ignition attempts with the ca pacitor at pin vdd to reduce stress on the hb components. 7.3.7 burn in the burn state, the lamp current regulat ion and all protection circuits are active. 7.3.7.1 lamp current control and dimming the ac lamp current is sensed by an external resistor connected to pin ifb. the resulting ac voltage on pin ifb is in ternally double-side rectified (dsr), and compared to a reference level by an ota. this reference le vel is determined by the internal reference regulation level v reg(ref) and the voltage on the dim input (uba2017a only), as shown in figure 8 ? lamp current control ? . definition: the regulation voltage on pin ifb (v reg(ifb) ) is the level seen from outside the ic to which the ic tries to regulate the average absolute voltage on pin ifb. if the dim input is not pres ent or not connected or v dim >v reg(ref) then v reg(ifb) is v reg(ref) + non-idealities from the ota and the dsr else v reg(ifb) =v dim + non-idealities from ota and dsr. the dim input controls the lamp current set point (uba2017a only). the dim input level is internally clamped to v reg(ref) . the lowest possible dim input level is set by the bias current on pin dim i bias(dim) and the external resistance on the pin. if no dimming is required, pin dim can be left open or connected via a capaci tor to ground. the internal current source i bias(dim) will then charge the pin until it is internally clamped to v reg(ref) .
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 12 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function the output of the ota is connected to pin cifb. the external capacitor c ext(cifb) is charged and discharged according to the voltage on the ota inputs and the transconductance of the ota, g m(ifb) according to the formula: i cifb =g m(ifb) (v ifb ? v reg(ifb ). more components can be connected to pin cifb to improve the response time and stability of the lamp current control loop. pin cifb is connected to the input of t he vco (voltage controlled oscillator) that determines the frequency of the ic. pin cifb voltage is inversely proportional to the switching frequency. when the load is inductive, an increase in frequency decreases the lamp current, and a decrease in frequency increases the lamp current. with the closed loop for the lamp current in place, the ic will regulate to the requir ed frequency for the desired lamp current. so when the ic enters the burn state it will go to either point d or h shown in figure 7 depending on the dim input voltage or v reg(ref) . dim input is only present in the uba2017a fig 8. lamp current control r ext(ifb) r i(ifb) c ext(cf) i ch(low)(cf) clock v high(cf) i bias(dim) v reg(ref) double side rectifier ota voltage controlled oscillator voltage controlled current source vdd vdd vdd c ext(cifb) cifb g m(ifb) vdd cf ifb dim i lamp / 2 aaa-001481
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 13 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function however, the switching frequency can never go below f sw(low) . if the regulation level is not reached at f sw(low) the ic will stay at f sw(low) (point e in figure 7 ). 7.3.7.2 operation without lamp current control to operate the lamp without current control the lamp current sense, pin ifb must be connected to ground. the lamp now operates at the lowest frequency f sw(low) (point e in figure 7 ). dimming is not supported in this case. 7.3.8 stop state when in the stop state, the ic is off and all dr iver outputs are low. th e ic will remain in the stop state until the voltage on pin vdd drops below v rst(vdd) or it is disabled, in which case it will go to the reset state. the sequence of events for entering the stop state are shown in figure 6 ? state diagram ? . 7.4 enable and disable the enable function works via pin ph/en. if this pin is pulled belo w the enable voltage v en(ph/en) , the ic goes into the standby state (imm ediately if glhb is high, otherwise it will continue its normal clock cycle until glhb is high and then go to the standby state). the external interface with pin ph/en for the en able signal should be an open collector or open drain type driver. to enable the ic, the open collector or open drain should be open (high ohmic) to not disturb the fixed frequ ency preheat setting function of pin ph/en. in the restart, standby and stop states, the standby pull-up current source i pu(stb)(ph/en) will pull the voltage at pin ph/en above v en(ph/en) . in the preheat, ignition and burn states, the normal output voltage driver of th e ic will pull the pin high. in those cases, the external driver must draw a current i clamp(ph/en) from the pin to disable the ic. 7.5 protection circuits 7.5.1 end-of-life rectifying lamp detection if voltage on pin eol is below low threshold voltage v th(low)eol or above v th(high)eol, the fault timer will start. a programmable end-of-life window is achieved by the internal bias current sink i bias(eol) . the effective relative size of the eol wind ow will decrease in line with the increasing series resistance connected to pin eol. the end-of-life lamp rectifying detectio n is only active during the burn state. 7.5.2 end-of-life overvoltage detection this protection is intended to protect against symmetrical lamp agin g. when in the burn state, the voltage on pin vfb exceeds the overvoltage end-of-life threshold voltage v th(oveol)(vfb) by more than 50 % of each swit ching cycle the fault timer will start. v th(oveol)(vfb) is related to the regulation voltage on pin ifb v reg(ifb) that itself is dependent on the voltage on pin dim (see section 7.3.7.1 ? lamp current control and dimming ? ) according to the formula : parameters a and b can be calculated from the v th(oveol)(vfb) values given in ta b l e 6 . v th oveol () vfb () abv reg ifb () ?=
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 14 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function the end-of-life overvoltage protection is on ly active during the burn state and (for uba2017a) if the voltage at pin dim is abov e the overvoltage end-of-life enable voltage v en(oveol)(dim) . 7.5.3 capacitive mode detection under all normal operating conditions, the half-bridge switching frequency should be higher than the load resonance frequency. the load then shows an inductive behavior in that the load current i load lags behind the half-bridge voltage v shhb . if the amplitude and the phase difference are large enough, the load current will charge any capacitance on pin shhb during the non-overlap time t no(lh) , and discharge it during the other non-overlap time t no(hl) . as a result, the voltage across the switch es is almost zero at the moment they turn on. this is called zero voltage switching; see figure 9 ? switching ? . zero voltage switching provides the highest switching efficiency and the least electromagnetic emission (eme). capacitive mode switching can occur when, due to any abnormal condition, the switching frequency is below the load resonance frequency. this can happen when the lamp is removed. the load current will th en keep the backgate diode of the switch that is switched off conducting during the non-overlap time, and if the other switch is turned on, a sudden step of the half-bridge voltage to the other supply rail takes place (which causes huge current spikes). also cross conduction between the switches can occur during the reverse recovery of the backgate diode. these effects put huge stress on the power switches. to protect against capacitive mode switch ing, the ic monitors pin shhb during the non-overlap time t no(lh) between switching off the low-si de switch and switching on of the high-side switch. if a rise of v shhb (dv shhb /dt > v th(cm)(shhb) ) during t no(lh) is not detected, the ic will conclude that capacitive mode switching is occurring during the next full cycle. if capacitive mode is detected longer than the fault ac tivation delay time t det(fault) then the ic will enter the stop state. capacitive mode detection is ac tive in all oscillating states. during ignition, a situation may occur where the amplitude of the load current is high and the half-bridge is at the boundary of capacitive mode switching; see figure 9 ? switching ? . the load current crosses zero during the non-overlap time. if the amplitude of the load current is large enough, the ic migh t not detect capacitive mode because v shhb did rise before going down again. the backgate diode of one switch is conducting again when the other switch switches on. since this can on ly happen if the load current crosses zero during the non-overlap time, the momentary va lue of the load current at the end of the non-overlap time will be not so significant, and is not lik ely to damage the switches. depending on the topology used, the dc blocking capacitor might be charged via the lamp(s) at the moment the lamp(s) ignite. this will cause a temporary dc current addition to the load current that might be interpreted by the ic as capacitive mode switching. if this happens, the dc blocking capacitor must be reduced or pre-charged. 7.5.4 hard switching protection the hard switching level v step(shhb) step is measured via pin shhb. the hard switching level is determined by measuring the voltage step on pin shhb on the rising edge of pin ghhb; see figure 9 ? switching ? . when v step(shhb) is above the hard switching protection threshold voltage on pin shhb (v th(hswp)shhb ), the fault timer is activated.
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 15 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function fig 9. switching 001aan209 v step(shhb) v fshb v shhb v hv vdd gnd gnd 0 v ghhb v glhb v shhb ghhb hv high side switch shhb gnd zero voltage switching i load t no(lh) sense t no(hl) hard switching (due to small phase difference between v shhb and i load ) hard switching (due to small amplitude of i load ) boundary of capacitive mode switching capacitive mode switching glhb low side switch i load
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 16 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function 7.5.5 coil saturation protection when the peak voltage on pin slhb exceeds saturation threshold voltage v th(sat)slhb , an additional current i add(cf) is sourced to pin cf to short en the running oscillator cycle. in the ignition state, the fault timer is started and a discharge current i dch(cifb) is drawn from pin cifb during the next cycle to increase the switching frequency. in the burn state, the ic will go to the stop st ate if coil saturation is detected longer than the saturation detec tion delay time t d(det)sat . current i bias(slhb) is sourced to pin slhb which will fo rce the controller into coil saturation protection if pin slhb is left open. 7.5.6 lamp overcurrent protection if voltage on pin ifb exceeds the overcurrent detection threshold voltage v th(ocd)(ifb) , and the oscillator is running at f sw(high) , an overcurrent is detecte d and the ic will immediately enter the stop state. 7.5.7 lamp overvoltage protection when the peak voltage on pin vfb exceeds v th(ov)(vfb) , the fault timer is started and a discharge current i dch(cifb) is drawn from pin cifb during the next cycle to increase the switching frequency. when v vfb >v th(ovextra)(vfb) for longer than the fault activation delay time t det(fault) then the ic will enter the stop state. 7.5.8 lamp removal detection removing the lamp from applications that ha ve the resonant capaci tor connected via the lamp filaments, will result in hard switching because curr ent cannot flow through the ballast inductor. if hard switching is detected during the ignition or burn state, the fault timer will be started. for applications with the resona nt capacitor connected directly to the ballast inductor, capacitive mode, coil saturation or over voltage will be det ected. capacitive mode is activated if the switching frequency ends up below the resonance frequency due to removal of the lamp. if the switching frequency is near or above the resonance frequency, the lamp (or rather the lamp socket) voltag e and half-bridge curr ent will be very high due to the unloaded resonant circuit (lamp inductor and lamp capacitor) which activates the coil saturation protection or the overvoltage protection. 7.5.9 temperature protection when the temperature is above t th(act)otp and glhb is high, the ic enters the standby state. the ic cannot exit the standby state until the temperature drops below t th(rel)otp . 7.5.10 fault timer any fault that starts the fault timer must be detected for longer than the fault activation delay time t d(act)fault to start the timer. when the timer is started, the capacitor at pin cpt is alternately being charged and discharged. af ter 8 charging and 7 discharging cycles the fault time-out period t to(fault) is reached and the ic enters either the stop state or the auto-restart state, depending on the fault detec ted, the current state of the timer and the number of ignition attempts; see figure 6 ? state diagram ? .
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 17 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function if the fault that started the timer is no longer detected for a period longer than the fault release delay time t d(rel)fault , the fault timer will be reset and at any new occurrence of the fault, the timer will start from zero. faults which activate the fault timer are shown as slowfault in figure 6 ? state diagram ? . the fault timer uses the same pin (cpt) to set the time with an external capacitor c ext(cpt) as the preheat timer. the ratio bet ween the preheat time-out time t to(ph) and the fault time-out time t to(fault) can be changed by adding an external series resistor r s(ext)(cpt) or an external parallel resistor r p(ext)(cpt) to the external capacitor c ext(cpt) ; see figure 10 ? cpt connections ? . the fault timer incorporates a protection that ensures safe operation conditions if the cpt pin voltage is below v th(scp)(cpt) (shorted to gnd) by holding the oscillation frequency at f sw(high) . fig 10. cpt connections 001aan210 c ext(cpt) r p(ext)(cpt) r s(ext)(cpt) cpt c ext(cpt) cpt c ext(cpt) cpt smaller ratio default ratio larger ratio t to(ph) /t to(fault) t to(ph) /t to(fault) t to(ph) /t to(fault)
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 18 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function 8. limiting values [1] positive and negative latch-up currents tested at t j = 150 c by discharging a 22 f capacitor though a 50 series resistor with a 350 h series inductor. latch-up current values are in accordance with the general quality specification. table 4. limiting values in accordance with the absolute maximum rating system (i ec 60134). all voltages referenced to signal ground (gnd pin 15); current flow into the ic is positive. symbol parameter conditions min max unit general r ref(iref) reference resistance on pin iref 30 36 k sr slew rate pins fshb, ghhb and shhb ? 4+4v/ns t amb ambient temperature ? 40 +125 c t j junction temperature ? 40 +150 c t stg storage temperature ? 55 +150 c voltage v fshb voltage on pin fshb continuous 0 570 v t<0.5s 0 630 v with respect to v shhb ? 0.3 +14 v v ghhb voltage on pin ghhb with respect to v shhb ? 0.3 +14 v v glhb voltage on pin glhb ? 0.3 +14 v v vdd voltage on pin vdd ? 0.3 +14 v v eol voltage on pin eol ? 9+9v v slhb voltage on pin slhb ? 9+9v v ifb voltage on pin ifb ? 5+5v v dim voltage on pin dim ? 0.1 +5 v v ph/en voltage on pin ph/en ? 0.1 +5 v v vfb voltage on pin vfb ? 0.1 +5 v current i vdd current on pin vdd - 50 ma i eol current on pin eol ? 1+1ma i slhb current on pin slhb ? 1+1ma electrostatic discharge (esd) v esd electrostatic discharge voltage human body model (hbm): jedec class 2 for pins: slhb, ifb, eol, cifb, cpt, iref, vfb, cf, dim, boost, ph/en, fbpfc, comppfc, auxpfc, gpfc, vdd and glhb ? 2+2kv jedec class 1c for pins: ghhb, fshb and shhb ? 1+1kv charge device model (cdm): jedec class 3 for all pins ? 500 +500 v latch-up i lu latch-up current [1] ? 100 +100 ma
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 19 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function 9. thermal characteristics 10. characteristics table 5. thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient in free air; mounted on a single-sided pcb; so16 package 120 k/w in free air; mounted on a single-sided pcb; dip16 package 90 k/w table 6. characteristics t amb = 25 c; settings according to default setting [1] ; all voltages referenced to gnd; cu rrent flow into the ic is positive; unless otherwise specified. symbol parameter conditions min typ max unit high voltage i leak leakage current v fshb =630v; v ghhb =630v; v shhb = 630 v; v vdd =0v -- 2 a start-up v startup(vdd) start-up voltage on pin vdd 11.9 12.4 12.9 v v stop(vdd) stop voltage on pin vdd 9.6 10.0 10.4 v v hys(vdd) hysteresis voltage on pin vdd 2.1 2.4 2.7 v i stb(vdd) standby current on pin vdd v vdd = 11.5 v 0.2 0.24 0.28 ma i pu(ph/en) pull-up current on pin ph/en standby or stop state; v ph/en =0.25v 7.7 9 10.3 a v rst(vdd) reset voltage on pin vdd 3.6 4.2 4.8 v v restart(vdd) restart voltage on pin vdd 6.2 6.5 6.8 v i restart(vdd) restart current on pin vdd v vdd = 9 v 0.85 1.1 1.35 ma v clamp(vdd) clamp voltage on pin vdd ic off; i vdd = 0.33 ma 13.0 13.4 13.8 v i clamp(vdd) clamp current on pin vdd ic off; v vdd = 14.0 v 25 45 - ma i vdd supply current 1.2 1.7 2.2 ma hb preheat r ext(ph/en) external resistance on pin ph/en 38.6 - - k t to(ph) preheat time-out time c cpt = 100 nf 0.8 0.94 1.08 s v o(ph/en) output voltage on pin ph/en during preheat or ignition state 1.78 1.84 1.9 v v ctrl(ph)slhb overcurrent protection threshold voltage on pin slhb preheat 0.44 0.48 0.52 v i ch(cifb) charge current on pin cifb no fault detected; preheat and ignition states only; v cifb =1.5v ? 10.3 ? 9.0 ? 7.7 a i dch(cifb) discharge current on pin cifb preheat overcurrent detected; v cifb =1.5v 7.7 9.0 10.3 a
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 20 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function f sw(ph) preheat switching frequency r ext(ph/en) =40k ; c ext(cf) =200pf 93 97.7 102.4 khz r ext(ph/en) = 100 k ; c ext(cf) =200pf 62 66 70 khz hb lamp ignition f sw(high) /f sw(low) high switching frequency to low switching frequency ratio 2.2 2.4 2.6 v fsw(low)(cifb) low switching frequency voltage on pin cifb -3.0-v v th(lod)(ifb) lamp on detection threshold voltage on pin ifb 1 1.11 1.22 v v th(lod)(vfb) lamp on detection threshold voltage on pin vfb 0.9 1.0 1.1 v v (vreg ? vth(lod)) regulation voltage to lamp-on-detect threshold voltage difference pin ifb 40 160 250 mv t d(lod) lamp on detection delay time 2 3 4 ms hb normal operation f sw(low) low switching frequency c cf = 200 pf 41 43 45 khz 20 - 80 khz v high(cf) high voltage on pin cf - 2.5 - v v reg(ifb) regulation voltage on pin ifb v cifb = 2 v; v ifb > 0 v 1.22 1.27 1.32 v v cifb = 2 v; v dim = 127 mv; v ifb >0v 77 127 177 mv v cifb = 2 v; v ifb < 0 v ? 1.34 ? 1.27 ? 1.2 v v cifb = 2 v; v dim = 127 mv; v ifb < 0 v ? 197 ? 127 ? 57 mv i ch(low)(cf) low charge current on pin cf - 47 - a v i(ifb) input voltage on pin ifb v cifb = 2 v ? 3.1 - +3.1 v r i(ifb) input resistance on pin ifb v ifb =1v - 60 - k v ifb = ? 1v - 30 - k v en(ph/en) enable voltage on pin ph/en 0.21 0.25 0.29 v v o(burn)(ph/en) burn state output voltage on pin ph/en burn state 1.21 1.27 1.33 v g m(ifb) ifb transconductance v cifb = 2 v 14 16.5 19 a/v i o(clamp)(ph/en) output current clamp on pin ph/en preheat, ignition or burn states; v ph/en =0.2v - - 0.16 ma hb driver i source(glhb) source current on pin glhb v glhb =4v ? 105 ? 90 ? 75 ma r sink(glhb) sink resistance on pin glhb v glhb = 2 v 13.5 16 18.5 i source(ghhb) source current on pin ghhb v shhb =0v; v ghhb =4v ? 105 ? 90 ? 75 ma r sink(ghhb) sink resistance on pin ghhb v shhb =0v; v ghhb = 2 v 13.5 16 18.5 t no non-overlap time 1.25 1.5 1.75 s v fd(bs) bootstrap diode forward voltage i fs = 5 ma 1.0 1.5 2.0 v table 6. characteristics ?continued t amb = 25 c; settings according to default setting [1] ; all voltages referenced to gnd; cu rrent flow into the ic is positive; unless otherwise specified. symbol parameter conditions min typ max unit
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 21 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function dimming i bias(dim) bias current on pin dim v dim =1v ? 28 ? 26 ? 24 a r i(dim) input resistance on pin dim v dim =2.5v - 30 - k hb protection v th(sat)(slhb) saturation threshold voltage on pin slhb 2.35 2.5 2.65 v t d(det)sat saturation detection delay time burn state - 0.3 - s t leb(slhb) leading edge blanking time on pin slhb 260 340 420 ns i add(cf) additional current on pin cf v slhb >v th(sat)slhb ; v cf =2v ? 107 ? 96 ? 85 a i bias(slhb) bias current on pin slhb v slhb =2.5v ? 10 ? 8.5 ? 7 a v th(ocd)(ifb) overcurrent detection threshold voltage on pin ifb 2.8 3.0 3.2 v v th(osp)(vfb) open/short protection threshold voltage on pin vfb 40 80 120 mv v th(ov)(vfb) overvoltage threshold voltage on pin vfb 2.4 2.5 2.6 v t det(fault) fault detection time - 125 - s overvoltage extra or capacitive mode during burn state -50- s t rel(fault) fault release time - 1 - ms v th(ovextra)(vfb) overvoltage extra threshold voltage on pin vfb 3.2 3.35 3.5 v i bias(vfb) bias current on pin vfb 2.3 2.6 2.9 a v th(low)eol low threshold voltage on pin eol 1 1.1 1.2 v v th(high)eol high threshold voltage on pin eol 2 2.25 2.5 v i bias(eol) bias current on pin eol v eol = 1.65 v 15.4 16.2 17 a v th(oveol)(vfb) overvoltage end-of-life threshold voltage on pin vfb uba2017 or uba2017a pin dim open 0.8 0.88 0.96 v uba2017a v dim = 1.0 v 0.92 1.0 1.08 v v dim = 0.5 v 1.15 1.23 1.31 v v en(oveol)(dim) overvoltage end-of-life enable voltage on pin dim uba2017a 0.21 0.25 0.29 v v th(hswp)shhb hard switching protection threshold voltage on pin shhb f sw =50khz -100-v v th(cm)shhb capacitive mode de tection threshold voltage on pin shhb t no(lh) -30-v/ s v th(scp)(cpt) short-circuit protection threshold voltage on pin cpt 80 120 160 mv r par(ext)(cpt) external parallel resistance on pin cpt 700 - - k r s(ext)(cpt) external series resistance on pin cpt - - 40 k t to(fault) fault time-out time c cpt = 100 nf 0.16 0.19 0.22 s table 6. characteristics ?continued t amb = 25 c; settings according to default setting [1] ; all voltages referenced to gnd; cu rrent flow into the ic is positive; unless otherwise specified. symbol parameter conditions min typ max unit
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 22 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function [1] default setting; see table 7 . t to(ph) /t to(fault) ratio between preheat time-out time and fault time-out time r par(ext) =700k ; r s(ext) not connected (short) 33.43.8 r par(ext) not connected (open); r s(ext) not connected (short) 4.7 5.2 5.7 r par(ext) not connected (open); r s(ext) =40k 911.514 temperature protection t th(act)otp overtemperature protection activation threshold temperature 120 140 160 c t th(rel)otp overtemperature protection release threshold temperature 65 80 95 c table 6. characteristics ?continued t amb = 25 c; settings according to default setting [1] ; all voltages referenced to gnd; cu rrent flow into the ic is positive; unless otherwise specified. symbol parameter conditions min typ max unit table 7. default setting s for characteristics pin name pin application slhb 1 connected to ground ifb 2 connected to ground eol 3 connected to a 1.6 v test supply vfb 4 connected to a 0.5 v test supply iref 5 connected via a 33 k resistor to ground cifb 6 connected via a 100 nf capacitor to ground cf 7 connected via a 200 pf c0g (np0) capacitor to ground cpt 8 connected via a 100 nf capacitor to ground dim 9 connected via a 100 pf capacitor to ground ph/en 10 not connected gnd 11 connected to ground vdd 12 connected to a 13 v test supply glhb 13 not connected (open) shhb 14 connected to ground fshb 15 connected to a 13 v test supply ghhb 16 not connected (open)
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 23 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function 11. application information 11.1 connecting the ic in an application a 33 k resistor must be connected between pi n iref and gnd. the tolerance of this resistor adds to any current related tolerances of the ic, including f sw(low) . no other components can be connected to pin iref. the tolerance and temperature dependency of the capacitor connected between pin cf and gnd will add to the tolerance on f sw(low) . a small decoupling capacitor (about 100 pf) is recommended on pin ifb close to the ic. normal sized decoupling capacitors (about 10 nf) are recommended on pins dim and eol. the capacitors at pins cf, cpt, fshb and vdd should also be placed close to the ic. a capacitor between pin cifb and gnd of at least 470 pf is needed for stability of the low switching frequency. a capacitor between pin vdd and gnd of at least 10 nf is needed for stability of the internal vdd voltage clamp. however, for relia ble operation of the ic a low esr type of at least 470 nf is recommended. a capacitor between pin fshb and shhb is needed to supply the high-side driver. the recommended value for this capacitor is 1 5 of the value of the capacitor at vdd. a series resistor of at least 1 k is recommended on pin slhb.
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 24 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function 12. package outline fig 11. package outline sot38-4 (dip16) references outline version european projection issue date iec jedec jeita sot38-4 95-01-14 03-02-13 m h c (e ) 1 m e a l seating plane a 1 w m b 1 b 2 e d a 2 z 16 1 9 8 e pin 1 index b 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. unit a max. 12 b 1 (1) (1) (1) b 2 cd e e m z h l mm dimensions (inch dimensions are derived from the original mm dimensions) a min. a max. b max. w m e e 1 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 0.76 4.2 0.51 3.2 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.03 0.17 0.02 0.13 dip16: plastic dual in-line package; 16 leads (300 mil) sot38-4
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 25 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function fig 12. package outline sot109-1 (so16) x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 8 9 1 16 y pin 1 index unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz ywv references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot109-1 99-12-27 03-02-19 076e07 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale so16: plastic small outline package; 16 leads; body width 3.9 mm sot109-1
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 26 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function 13. revision history table 8. revision history document id release date data sheet status change notice supersedes uba2017 v.2 20120515 product data sheet - uba2017 v.1 uba2017 v.1 20120330 preliminary data sheet - -
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 27 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function 14. legal information 14.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 14.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 14.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? 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applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
uba2017 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 15 may 2012 28 of 29 nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 14.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 15. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors uba2017/uba2017a 600 v fluorescent lamp driver with linear dimming function ? nxp b.v. 2012. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 15 may 2012 document identifier: uba2017 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 16. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 functional description . . . . . . . . . . . . . . . . . . . 5 7.1 introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.2 half-bridge driver . . . . . . . . . . . . . . . . . . . . . . . 5 7.2.1 vdd supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.2.2 low- and high-side drivers . . . . . . . . . . . . . . . . 6 7.2.3 non-overlap . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.3 fluorescent lamp control . . . . . . . . . . . . . . . . . 7 7.3.1 reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.3.2 standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.3.3 oscillating states (prehea t, ignition and burn) . 9 7.3.4 preheat . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.3.5 ignition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7.3.6 auto-restart . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7.3.7 burn . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7.3.7.1 lamp current control and dimming . . . . . . . . . 11 7.3.7.2 operatio n without lamp current control. . . . . . 13 7.3.8 stop state . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 7.4 enable and disable . . . . . . . . . . . . . . . . . . . . 13 7.5 protection circuits . . . . . . . . . . . . . . . . . . . . . . 13 7.5.1 end-of-life rectifying lamp detection . . . . . . . . 13 7.5.2 end-of-life overvoltage detection . . . . . . . . . . 13 7.5.3 capacitive mode detection . . . . . . . . . . . . . . . 14 7.5.4 hard switching protection . . . . . . . . . . . . . . . . 14 7.5.5 coil saturation protection . . . . . . . . . . . . . . . . 16 7.5.6 lamp overcurrent protection. . . . . . . . . . . . . . 16 7.5.7 lamp overvoltage protection . . . . . . . . . . . . . 16 7.5.8 lamp removal detection . . . . . . . . . . . . . . . . . 16 7.5.9 temperature protection. . . . . . . . . . . . . . . . . . 16 7.5.10 fault timer. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 18 9 thermal characteristics . . . . . . . . . . . . . . . . . 19 10 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 19 11 application information. . . . . . . . . . . . . . . . . . 23 11.1 connecting the ic in an application . . . . . . . . 23 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . 24 13 revision history . . . . . . . . . . . . . . . . . . . . . . . . 26 14 legal information. . . . . . . . . . . . . . . . . . . . . . . 27 14.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 27 14.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 14.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 27 14.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 28 15 contact information . . . . . . . . . . . . . . . . . . . . 28 16 contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29


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